Exhibition Outline

  • Visitor Profile

    • Electronics Manufacturers: Design/Development, Manufacturing Technology, Production Technology Div.
    • Material Manufacturers: R&D, Manufacturing Technology, Production Technology Div.
    • Exhibit Profile

      Electronic Materials

      Materials for Mounted Circuit

      • Polyimide Film
      • Conductive Polymer
      • Adhesive Tape
      • Solder
      • LCD Polymer Film
      • Copper Foil
      • Circuit Conductive Ink/Paste
      • Dye Bonding Agent
      • PET Film
      • Alminium Foil
      • Antistatic Material
      • Resist  etc.
      • PPS Film
      • Conductive Adhesive
      • Sealant
      • Chemical Agent
      • PEN Film
      • Light Curing Adhesive
      • Heat Shrinkable Tube
      • Copper Clad Laminate
      • Engineering Plastic Film
      • Adhesive Compound
      • Heat Radiation Sheet

      Materials for Record Medium

      • Base Film
      • Sensitive Material
      • Resin
      • Coating Agent
      • Magnetic Agent
      • Colored Dye
      • Plating
      • Glass Substrate  etc.

      Materials for Semiconductor

      • Sealant
      • Chemical Agent
      • Underfill Material
      • CMP Pad
      • Particular Gas
      • Polycrystal Silicon
      • Coating Insulating Resin
      • CMP Slurry
      • Photoresist
      • Silicon Carbide  etc.

      Materials for Display

      • Alignment
      • Resist, Liquid Developer, Detachment
      • Sealing Material
      • Dry Material
      • Electrode Material
      • Optical Film
      • LCD Material
      • Functional Film
      • Encapsulation Resin
      • Characteristic Increment Film
      • OLED/Luminescence Material
      • Coating Film  etc.

      Materials for Battery

      • Positive/Negative Electrode Material
      • Insulation Tube
      • Current Collector
      • Hydrogen Storing Alloy
      • Safety Valve
      • Separator
      • Electrolyte
      • Activated Charcoal
      • Electrode Foil
      • Ionic Liquid  etc.

      Other Materials

      • Nano Technology Materials
      • Photocatalyst Materials
      • Ceramic Materials
      • Biodegradability Materials
      • Hybrid Materials
      • Intelligent Materials  etc.
    • Forming/Processing Zone

      • Coating Equipment
      • Vacuum Forming Machine
      • Laminating Equipment
      • Heating Furnace
      • Separator
      • Casting Equipment
      • Die Assembly
      • Junction/Fusion Processing Machine
      • Drying Furnace
      • Concentration Device
      • Extruder
      • Slice Processing Equipment
      • Cleaning Equipment
      • Film Forming Device
      • Cutter
      • Stretch Machine
      • Disperser
      • Agitator
      • Injection Molding Machine
      • Die-cutting Machine
      • Winder, Rewinder
      • Mixing Equipment
      • Vacuum Equipment
      • Slitter
      • Bonding Processing Machine
      • Crusher  etc.
    • Test/Analysis/Measurement Zone

      • Physical Evaluation Test Machine
      • Microscope
      • Reliability Evaluation Test Machine
      • Analyzer
      • Analysis Device
      • Simulation Software
      • Test/Measurement Equipment
      • Evaluation/Test/Analysis Contract Service  etc.
Concurrent Shows

Contact Us

MATERIAL JAPAN
Show Management
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL : +81-3-3349-8518
FAX : +81-3-3349-8530
E-mail : inw@reedexpo.co.jp

Organised by Reed Exhibitions