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Exhibition Outline

Exhibition Title MATERIAL JAPAN–2nd Advanced Electronic Materials Expo
Held within NEPCON JAPAN × ELECTRONIX R&D JAPAN
  - 40th INTERNEPCON JAPAN
  - 28th ELECTROTEST JAPAN
  - 12th IC PACKAGING TECHNOLOGY EXPO
  - ELE TRADE–12th International Electronic Components Trade Show
  - PWB EXPO–12th Printed Wiring Boards Expo
  - MicroTech JAPAN–1st Micro Fabrication / Fine Process Technology Expo
Concurrent Shows CAR-ELE JAPAN–3rd Int'l Automotive Electronics Technology Expo
EV JAPAN–2nd EV & HEV Drive System Technology Expo
1st Automotive Lightening Technology Expo
LIGHTING JAPAN–3rd LED/OLED Lighting Technology Expo
Dates January 19 (Wed) - 21 (Fri), 2011
Venue Tokyo Big Sight, Tokyo, Japan
Special Zone Forming / Processing Zone
Analysis / Test / Measurement Zone
Organised by Reed Exhibitions Japan Ltd.
Services included in
the exhibit price
  • Exhibit Raw Space (excluding display system cost such as the walls, carpet, etc.)
  • Free Invitation Tickets
  • Special VIP Customers Invitation System
  • Free promotion of exhibition by press released to industry's prominent publication / magazines
  • Publishing of your exhibiting information on official website
  • Publishing of your company name & exhibiting information in "Floor Plan" & "Official Web Directory" which are distributed to all visitors

*Other services to increase your exhibiting effect are also available.
Visitor Profile
  • Electronics Manufacturers: 
Design/Development, Manufacturing Technology,
Production Technology Div.
  • Material Manufacturers: 
R&D, Manufacturing Technology, Production Technology Div.
Exhibit Profile Electronic Materials
♦ Materials for Mounted Circuit
  • Polyimide Film
  • PPS Film
  • Conductive Polymer
  • Conductive Adhesive
  • Adhesive Tape
  • Sealant
  • Solder
  • Chemical Agent
  • LCD Polymer Film
  • PEN Film
  • Copper Foil
  • Light Curing Adhesive
  • Circuit Conductive Ink/Paste
  • Heat Shrinkable Tube
  • Dye Bonding Agent
  • Copper Clad Laminate
  • PET Film
  • Engineering Plastic Film
  • Alminium Foil
  • Adhesive Compound
  • Antistatic Material
  • Heat Radiation Sheet
  • Resist
etc.
♦ Materials for Record Medium
  • Base Film
  • Magnetic Agent
  • Sensitive Material
  • Colored Dye
  • Resin
  • Plating
  • Coating Agent
  • Glass Substrate
etc.
♦ Materials for Semiconductor
  • Sealant
  • Polycrystal Silicon
  • Chemical Agent
  • Coating Insulating Resin
  • Underfill Material
  • CMP Slurry
  • CMP Pad
  • Photoresist
  • Particular Gas
  • Silicon Carbide
etc.
♦ Materials for Display
  • Alignment
  • LCD Material
  • Resist, Liquid Developer, Detachment
  • Functional Film
  • Sealing Material
  • Encapsulation Resin
  • Dry Material
  • Characteristic Increment Film
  • Electrode Material
  • OLED/Luminescence Material
  • Optical Film
  • Coating Film
etc.
♦ Materials for Battery
  • Positive/Negative Electrode Material
  • Separator
  • Insulation Tube
  • Electrolyte
  • Current Collector
  • Activated Charcoal
  • Hydrogen Storing Alloy
  • Electrode Foil
  • Safety Valve
  • Ionic Liquid
etc.
♦ Other Materials
  • Nano Technology Materials
  • Biodegradability Materials
  • Photocatalyst Materials
  • Hybrid Materials
  • Ceramic Materials
  • Intelligent Materials
etc.
Forming/Processing Equipment
  • Coating Equipment
  • Film Forming Device
  • Vacuum Forming Machine
  • Cutter
  • Laminating Equipment
  • Stretch Machine
  • Heating Furnace
  • Disperser
  • Separator
  • Agitator
  • Casting Equipment
  • Injection Molding Machine
  • Die Assembly
  • Die-cutting Machine
  • Junction/Fusion Processing Machine
  • Winder, Rewinder
  • Drying Furnace
  • Mixing Equipment
  • Concentration Device
  • Vacuum Equipment
  • Extruder
  • Slitter
  • Slice Processing Equipment
  • Bonding Processing Machine
  • Cleaning Equipment
  • Crusher
etc.
Test/Analysis/Measurement Equipment
  • Physical Evaluation Test Machine
  • Analysis Device
  • Microscope
  • Simulation Software
  • Reliability Evaluation Test Machine
  • Test/Measurement Equipment
  • Analyzer
  • Evaluation/Test/Analysis Contract Service
etc.
Contact Us MATERIAL JAPAN Show Management
Attn: Hajime Suzuki (Mr.), Taikoku Kin (Mr.), Kanako Otsuka (Ms.)
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL: +81-3-3349-8502  FAX: +81-3-3349-4900
E-mail: material@reedexpo.co.jp
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